Package Development, Signal Integrity and Power Integrity Engineer, Distinguished

25 Minutes ago • 12 Years + • $146,850 PA - $220,000 PA
System Design

Job Description

The Marvell Advanced Packaging team is responsible for package design and technology development for next-generation HPC, AI, and networking solutions. This role involves architecting complex future package developments, leading new product introductions, and interacting with customers to develop market-leading packaging solutions. The engineer will focus on signal integrity, power integrity, thermal integrity, mechanical integrity, high-speed signaling, and complex power delivery networks, often involving multi-chip, 2.5D, and 3D packages.
Good To Have:
  • People and/or team leadership is a strong plus
  • Experience with 2.5D/3D package development is highly desired
Must Have:
  • Leverage strong knowledge of developing complex systems like switches, accelerators, AEC and optics to architect complex future package developments
  • Proven track record of new product introduction from concept, through development and production
  • Proven track record of technical leadership in the organization
  • Ability to interact with customers, understand their requirements and develop packaging solutions meeting or exceeding customer expectations
  • Experience with developing systems with high-speed interfaces like DDR, SERDES and Die2Die interfaces
  • Strong understanding of Signal and Power Integrity, and EMC issues for IC packages, PCBs and connectors
  • Knowledge of the thermal and mechanical issues of the IC package development
  • Ability to work with and drive engineers from different disciplines (SI, PI, Pkg architecture, System design, Assembly, Thermal & Mechanical engineers) to develop market leading packaging solutions
  • Working knowledge of solving and debugging issues in the lab for high-speed systems
  • Strong communication, presentation, and documentation skills
  • A team player
  • Interest in hardware design and experience working on signal and power integrity verification and design optimization
  • Knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies
  • Bachelor's degree in electrical engineering or related fields and 15+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery and 12+ years of experience.
Perks:
  • Total compensation package with a base, bonus and equity
  • Health and financial wellbeing
  • Flexible time off
  • 401k
  • Year-end shutdown
  • Floating holidays
  • Paid time off to volunteer

Add these skills to join the top 1% applicants for this job

problem-solving
team-player
game-texts
networking
system-design

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer’s most challenging designs and integrations with industry-leading packaging technologies

What You Can Expect

  • Leverage strong knowledge of developing complex systems like switches, accelerators, AEC and optics to architect complex future package developments
  • Proven track record of new product introduction from concept, through development and production
  • Proven track record of technical leadership in the organization
  • Ability to interact with customers, understand their requirements and develop packaging solutions meeting or exceeding customer expectations
  • Experience with developing systems with high-speed interfaces like DDR, SERDES and Die2Die interfaces
  • Strong understanding of Signal and Power Integrity, and EMC issues for IC packages, PCBs and connectors
  • Knowledge of the thermal and mechanical issues of the IC package development
  • Ability to work with and drive engineers from different disciplines (SI, PI, Pkg architecture, System design, Assembly, Thermal & Mechanical engineers) to develop market leading packaging solutions
  • Working knowledge of solving and debugging issues in the lab for high-speed systems
  • Experience with 2.5D/3D package development is highly desired
  • Strong communication, presentation, and documentation skills
  • A team player

What We're Looking For

The ideal candidate will have an interest in hardware design and experience working on signal and power integrity verification and design optimization. People and/or team leadership is a strong plus. A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies is required. In addition, the candidate will possess a bachelor's degree in electrical engineering or related fields and 15+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery and 12+ years of experience.

Expected Base Pay Range (USD)

146,850 - 220,000, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Set alerts for more jobs like Package Development, Signal Integrity and Power Integrity Engineer, Distinguished
Set alerts for new jobs by Marvell
Set alerts for new System Design jobs in United States
Set alerts for new jobs in United States
Set alerts for System Design (Remote) jobs

Contact Us
hello@outscal.com
Made in INDIA 💛💙