Semiconductor Packaging Engineering Intern - Fall 2025

13 Hours ago • All levels • Software Development & Engineering

Job Summary

Job Description

NXP's Technology organization is crucial for delivering high-quality, scalable, and cost-competitive technologies. The Packaging Innovation (PI) team is responsible for implementing packaging solutions for new product introductions and technology development for various business product lines. Interns will assist packaging engineers in defining and validating packages for new NXP products. This may involve lab work for testing and mechanical analysis of packages and materials, using CAD for package definition, or modeling package performance (thermal, mechanical, electrical). The role also involves addressing and resolving design, material, and processing issues that arise during development.
Must have:
  • B.S, M.S. or Ph.D. Candidate in Materials Science, Mechanical Engineering or Electrical Engineering
  • Team player with positive attitude
  • Self-driven with good communication and presentation skills
  • Willingness to learn and apply fundamental knowledge
  • Working knowledge of MS Office tools (PowerPoint, Word, Excel)
Good to have:
  • Working knowledge of CAD tools and/or Finite Element Simulation tools
  • Working knowledge of various IC packages (QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out)
  • Knowledge of Statistical Data Analysis (graphing/plotting, Design of Experiment)
  • Knowledge of soldering and intermetallic compounds

Job Details

NXP’s Technology (CTO) organization plays an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers.

The Packaging Innovation (PI) organization in CTO is responsible for the implementation of packaging solutions for new product introduction and new technology development for electronic packages for the varied business product lines.

Job Summary:

  • Work with packaging engineers to help define and validate packages used for new products for NXP. 
  • Potential working in the lab to perform tests and mechanical analysis to evaluate packages and materials used in microelectronic packages.
  • Potential working with the design team using CAD to define packages that will be used for new products.   
  • Potential working with Package Innovation team modeling package performance (thermal, mechanical, electrical)
  • Address and solve design, materials and processing issues that may occur during the development process.

Job Qualifications:

  • B.S, M.S. or Ph.D. Candidate in Materials Science, Mechanical Engineering or Electrical Engineering.
  • Ability to be a team player with positive attitude, self-driven, with good communication and presentation skills (both written and verbal).
  • Willingness to learn new concepts and apply fundamental knowledge to engineering problems. 
  • Working knowledge of MS Office tools like PowerPoint, Word, Excel is required.
  • Working knowledge of CAD tools and/or Finite Element Simulation tools is a plus.
  • Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
  • Knowledge of Statistical Data Analysis incl. graphing/plotting and Design of Experiment is a plus.
  • Knowledge of soldering and intermetallic compounds is a plus.

In order to be considered for an internship with NXP, you must be returning to school (or graduating) at the conclusion of the internship term. If you are graduating prior to Dec 2025, please apply for positions labeled “Graduate Hire” or “Entry Level”.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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About The Company

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.comRead MoreCareer Development OpportunitiesBright Minds. Bright Futures.We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.Read MoreCommitment At NXP.We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future.

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