Silicon Packaging Engineering Manager

Job Details:

Job Description:

• Lead and manage a team of silicon physical design engineers responsible for end-to-end silicon design engineering activities supporting technology development, and product design execution on EMIB 2.5D/3.5D, Foveros S/R/B, and Foveros Direct 3D Intel foundry advanced packaging technologies.
• Oversee planning, scheduling, and execution of design projects, ensuring milestones and deadlines are met.
• Drive continuous improvement in design methodologies, flows, and processes to enhance quality and efficiency.
• Collaborate with cross-functional teams (technology partners, packaging, analysis, and verification) to ensure seamless integration and manufacturability.
• Provide technical leadership and mentorship, fostering a culture of innovation and accountability.
• Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.
• Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

Key Responsibilities:

Leadership and Management

• Lead and manage a group of Silicon Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.
• Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.
• Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.
• Lead design groups, coordinating efforts across multiple teams to achieve project goals.

Technical Expertise

• Serve as the technical lead for the package design team cross multiple products.
• Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.
• Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.
• Leverage extensive experience in advanced packaging designs to meet design KPIs.
• Influence.
• Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.

Project Management

• Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.
• Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.
• Conduct regular project reviews and provide status updates to senior management.

Innovation and Improvement

• Identify and implement process improvements to enhance the efficiency and quality of package designs and development.
• Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.
• Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.

The ideal candidate should exhibit the following behavioral traits:

• Excellent leadership and team management skills, with the ability to inspire and motivate a diverse team of engineers.
• Strong project management skills, with the ability to manage multiple projects simultaneously and meet deadlines.
• Exceptional problem-solving and analytical skills, with a keen attention to detail.
• Excellent communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and stakeholders.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience
• -OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience
• -OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience

Relevant experience should include the following:

• Experience in silicon design, with at least 3 years in a leadership role.
• Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects within established timelines.
• Experience with design flows and methodologies (physical design, verification).
• Experience working with EDA tools from Cadence, Synopsys, and/or Siemens.

Preferred Qualifications:

• Experience with advanced nodes and packaging technologies
• Experience in RTL2GDS flows and methodologies

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

US, Oregon, Hillsboro

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.