Assembly Backend Process Engineering

1. He/She role will be as Process engineer at BE BGA Assembly Process Engineering Group which will supporting processes such as Package Saw and Punch Singulation.

2. To raise MDR (Material Disposition Review) for non-conformance products.

3. Perform necessary assessment, evaluation and documentation in change management.

4. Provide lot disposition timely.

5. Perform Measurement System Analysis that includes Gage Repeatability and Reproducibility.

6. Liase with machine supplier on issues pertaining to machine.

7. Drive yield improvements in BGA BE.

Requirements:

1. Graduate with bachelor's degree in mechanical engineering field.

2. Has working experience in semiconductor manufacturing. (Experience in Back-End assembly is a plus, especially in BGA)

3. Proficient in Bahasa Malaysia & English (Both Read/Write)

4. Has experience in Microsoft (Excel, Powerpoint, Word & etc)

5. Has good problem solving and analytical thinking skills.

6. Able to work under pressure and tight schedule.

Career Development Opportunities

Bright Minds. Bright Futures.

We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.

Commitment At NXP.

We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.