The Packaging Module Development Manager in ATD-Asia will lead efforts to develop, integrate, and certify materials for Intel’s Packaging Technologies, ensuring HVM readiness. This role involves influencing material and supplier strategies, applying strong technical problem-solving skills in materials science (polymers, metals, composites). Responsibilities include planning and executing new material evaluation programs, conducting technology assessments, and collaborating with internal and external partners. The position requires strong communication, project management, negotiation, and influencing skills, with travel to supplier and assembly sites.
Good To Have:- Knowledge of statistical methods
- Design of Experiments knowledge
Must Have:- Lead efforts to develop, integrate, and certify materials in support of assembly packaging development & HVM readiness.
- Communicate and influence materials and supplier directions, strategies, and decisions.
- Apply sound technical problem-solving skills in resolving materials-process-equipment issues.
- Plan and execute programs for evaluating new material and supplier technologies.
- Conduct material/supplier technology assessments and make material/supplier technology recommendations/certifications.
- Work in close collaboration with MTD and ME teams in ATD along with Global materials, Core competency, Q&R, and Technology Integration partners.
- Work with external materials suppliers.
- Possess effective communication and presentation skills, project and team management skills, negotiation skills, and influencing skills.
- Ph.D. degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Science and Engineering, or Metallurgy.
- Excellent understanding of materials characterization tools and techniques.
- Strong understanding of Packaging assembly materials-process-equipment integration and materials supplier management.
- Ability to closely collaborate across multiple teams and sites.