AI Compute and Chiplet Systems Engineer, Staff

Qualcomm is seeking a Staff AI Compute and Chiplet Systems Engineer to drive innovation in 2.5D/3D chiplet and networking solutions. The role involves developing technology-systems co-optimized for heterogeneous compute, defining next-generation SoC and platform architectures, and mapping AI use cases to chip-integration solutions. The engineer will apply detailed knowledge of process technology, 2.5D/3D chiplet architecture, and networking technologies to perform system KPI analysis and drive 3D architecture strategies for new product introduction.

Must Have

• Develop 2.5D/3D chiplet and networking solutions
• Define next-generation SoC and platform architectures
• Drive innovation in mapping AI and compute use cases to chip-integration solutions
• Perform system KPI analysis for 3D architecture and stacking strategies
• Excellent understanding of AI use case KPI dependency on process and system architecture
• Good knowledge of heterogeneous architecture and 2.5D/3D integration schemes
• Basic programming skills (e.g., Python) for modeling system use case impact
• Master's in Electrical Engineering, Computer Science, or related field (or Bachelor's with 5+ years, PhD with 3+ years)
• Experience in ASIC design, verification, validation, or integration (4+ years with Bachelor's, 3+ years with Master's, 2+ years with PhD)

Good to Have

• Knowledge of different IPs (CPU, GPU, NPU) and their interaction for E2E use cases
• Ability to work without much supervision and as part of a team
• Advanced data analysis and interpretation skills

Perks & Benefits

• World-class health benefit options
• Programs to build and prepare for a financially secure future
• Self and family resources for emotional/mental strength and resilience
• Wellbeing programs and resources for Live+Well and Work+Well support
• Continuous learning and development programs
• Tuition reimbursement
• Mentorships

Job Posting Date

2025-12-18

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible and drives communication and data processing transformation to help create a smarter, connected future for all. In this journey, Qualcomm is evolving into an “AI-first” intelligent-edge powerhouse, combining high-performance, low-power compute and seamless connectivity while pushing intelligence closer to users through ultra-efficient, on-device AI that ensures privacy, personalization, and real-time responsiveness. This is the Invention Age - and this is where you come in.

Job Overview and Responsibility

We are seeking a highly skilled engineer to develop 2.5D/ 3D chiplet and networking solution based technology-systems co-optimized for a unique era of heterogeneous compute as Moore’s law slows down. He/she should be able to apply that knowledge to define Qualcomm’s next generation SoC and platform architectures including partitions for logic and memories and involving 2.5D/3D chiplets and networking technologies to connect them.

Candidate will also drive innovation in the group to effectively map emerging AI and other compute use cases to process and chip-integration solutions with detailed knowledge of process technology, 2.5D/ 3D chiplet architecture, networking technologies and trade-offs. Knowledge of different Ips e.g. CPU, GPU, NPU and how they act together to drive an E2E use case is a plus. Candidate will work with internal architecture and system teams to develop 2.5D/3D partitions and map to 3D stacking topologies. Candidate will perform system KPI analysis to drive 3D architecture and stacking strategies for new product introduction.

Minimum Qualifications:

• Excellent understanding of generic and AI use case KPI dependency on process and system architecture involving chiplets and networking technologies.
• Good knowledge of heterogeneous architecture, 2.5D/ 3D integration schemes.
• Basic programming skills e.g. ability to model e.g. in Python or other languages system use case impact of 3D architectures, integration schemes.
• Master's in Electrical Engineering, Computer Science, or a related field

Additional Qualifications:

• Ability to work without much supervision and as part of a team
• Most tasks do not have defined steps; simultaneous use of multiple mental abilities is generally required to determine the best approach
• Advanced data analysis and interpretation skills are required.

Minimum Qualifications

• Bachelor's degree in Science, Engineering, or related field and 5+ years of AI relevant System and technology or related work experience.

OR

• Master's degree in Science, Engineering, or related field and 4+ years of AI relevant System and technology or related work experience.

OR

• PhD in Science, Engineering, or related field and 3+ years of AI relevant System and technology or related work experience.

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.

OR

• Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.

OR

• PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

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