Job Description
Cadence is seeking a Lead Design Engineer for their Invecas Hyderabad location. The role requires 5-15 years of experience with expertise in DFT, SCAN, ATPG, JTAG, and MBIST. Responsibilities include chip tape out, ATE bring-up, gate-level simulations, and test structure development. The ideal candidate will have strong knowledge of industry-standard tools and scripting skills, contributing to successful project tape-outs and post-silicon debug.
Must Have:
- B-Tech/M-tech with 5 Years to 15 Years relevant experience
- Very good knowledge on SCAN/ATPG/JTAG/MBIST
- Experience with one or more chip tape out that includes chip ATE bring up
- Experience on gate level simulation with no timing and timing (SDF) simulations (ATPG/MBIST/JTAG)
- Experience in Test structures for DFT, IP integration, ATPG fault models, test point insertion, coverage improvement techniques
- Experience in scan insertion techniques at block level and chip top level
- Experience on Memory BIST generation, insertion, verification on RTL/Netlist level
- Good knowledge and understanding in Analog PHY and Analog Macro tests
- Good knowledge and understanding on JTAG for IEEE 1149.1/IEEE1149.6 standards
- Good knowledge on test mode timing constraints
- Good knowledge about running block level and chip STA flows
- Cross domain knowledge to resolve DFT issues with design, synthesis, physical design, STA team
- Proficiency in industry standard tools for scan insertion, ATPG, MBIST and JTAG (preferable Cadence/Tessent tools)
- Experience with post-silicon bring up and debug on ATE
- Good knowledge on Perl/Tcl scription skills
- Very good team player capabilities and excellent communication skills to work with a variety of teams across the global organization
- High sense of responsibility and ownership within the team for successful tape out and post-silicon bring up of project
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
- Should have B-Tech/M-tech with 5 Years to 15 Years relevant experience.
- 4-14years
- Very good knowledge on SCAN/ATPG/JTAG/MBIST
- Experience with one or more chip tape out that includes chip ATE bring up.
- Experience on gate level simulation with no timing and timing (SDF) simulations (ATPG/MBIST/JTAG)
- Experience in Test structures for DFT, IP integration, ATPG fault models, test point insertion, coverage improvement techniques.
- Experience in scan insertion techniques at block level and chip top level.
- Experience on Memory BIST generation, insertion, verification on RTL/Netlist level.
- Good knowledge and understanding in Analog PHY and Analog Macro tests.
- Good knowledge and understanding on JTAG for IEEE 1149.1/IEEE1149.6 standards.
- Good knowledge on test mode timing constraints
- Good knowledge about running block level and chip STA flows.
- Cross domain knowledge to resolve DFT issues with design, synthesis, physical design, STA team.
- Proficiency in industry standard tools for scan insertion, ATPG, MBIST and JTAG (preferable Cadence/Tessent tools)
- Experience with post-silicon bring up and debug on ATE.
- Good knowledge on Perl/Tcl scription skills
- Very good team player capabilities and excellent communication skills to work with a variety of teams across the global organization.
- High sense of responsibility and ownership within the team for successful tape out and post-silicon bring up of project.
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