Lead Design Engineer

About the team:

Our team deliver many high-performance products based on the industry’s advanced technology with high frequencies up to 6400MHz. Our product processes include TSMC 3nm/5nm/7nm/12nm and Samsung 4nm/5nm/7nm/8nm/10nm, etc. In the team you will face great challenges such as FP, CTS, STA, etc. At the same time, you will get rich experience and advanced methodology.

Job Responsibilities:

Focus on high speed digital DDR and HBM IP physical implementation, develop necessary scripts or tools to enhance current PD design flow.

Work in product projects, including but not limited to: complete the project tasks; solve design issue and provide flow to check and avoid similar issue; analyze and summarize PPA optimization methodologies and results, implement optimal design parameters and flows for different projects.

Job Requirement:

• BS/MS in EE with at least 3 years relevant IC design experience.
• Good physical design experience in the digital implementation domain including Floorplan, CTS, STA, Physical verification, Power analysis.
• Solid background in circuits, electronics, physics, be willing to learn new technology for cutting edge process node and advanced design methodology.
• Skilled in scripting language, such as Perl, C shell, TCL, Makefile, Python.
• Familiar with EDA tools like Innovus, ICC, Calibre, Tempus, PrimeTime, etc.