NPI Process Development Engineer

2 Months ago • All levels
Software Development & Engineering

Job Description

NXP is seeking an NPI Process Development Engineer responsible for developing and qualifying new LQFP & BGA packages for total assembly processes in automotive applications. This role involves ensuring quality, yield, cost, and process improvements, as well as creating comprehensive process documentation. The engineer will collaborate with cross-functional teams and management to align project scopes and directions, contributing to the advancement of secure connectivity solutions.
Good To Have:
  • Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development.
  • Project Management knowledge.
Must Have:
  • Develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
  • Responsible for quality, yield, cost, and process improvement activities.
  • Responsible for process documentation, process spec, standard work instruction, OCAP, QIT.
  • Collaborate closely with cross-functional team members to resolve conflicts and make fast decisions.
  • Take ownership to work closely with upper management to align scope and direction of key projects.
  • Bachelor in Engineering.
  • Knowledge and work experience with semiconductor assembly background for automotive customers.
  • Good technical knowledge and hands-on experience in process characterization for key processes.
  • Great interpersonal skills, leadership skills, result-oriented, self-driven.
  • Good SPC, Process Control and other relevant statistical & problem-solving skills.
  • Proficiency in Microsoft applications (PowerPoint, Excel Macro, Word).
Perks:
  • Online and offline learning opportunities to develop core and professional skills.
  • Programs focused on diversity, inclusion and equality.

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  • Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
  • Responsible for quality, yield, cost and process improvement activities.
  • Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.
  • Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
  • Take ownership to work closely with upper management to align scope and direction of key projects.

Job Qualification

  • Bachelor in Engineering, knowledge and work experience with semiconductor assembly background for automotive customers. Fresh graduates are encouraged to apply.
  • Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
  • Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
  • Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
  • Good SPC, Process Control and other relevant statistical & problem-solving skills
  • Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

Career Development Opportunities

Bright Minds. Bright Futures.

We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.

Commitment At NXP.

We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.

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