Packaging Module Development Engineer

This role is for a Process Development Engineer in Solder Ball Attach or Chip Attach Process within Intel's Technology Development Organization. The engineer will focus on process and technology development for new products, shuttle programs, test vehicles, and foundry products. Key responsibilities include pathfinding, developing, qualifying, and ramping materials for high volume manufacturing, applying principles of DOE and data analysis, and optimizing manufacturing efficiency to meet quality, reliability, cost, yield, productivity, and manufacturability requirements. The role involves fundamental studies, experiments to characterize materials, and collaboration with cross-functional teams.

Must Have

• Process Development Engineer role in Solder Ball Attach or Chip Attach Process.
• Focus on Process and Technology Development for New Product (NPI), Shuttle Program, Test Vehicle and Foundry Product.
• Technical knowledge in Research and Development, Process Development, Process Engineering.
• Experience with Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA).
• Experience in Quality, Yield Improvement, Optimization.
• Pathfinding, developing, qualifying, and ramping materials for high volume manufacturing.
• Developing process specifications using DOE and data analysis.
• Optimizing manufacturing efficiency for quality, reliability, cost, yield, productivity, and manufacturability.
• Conducting fundamental studies and experiments to characterize materials and processes.
• MSc/MEng/BEng degree in Mechanical, Materials, Chemical, Electrical, Physics, or Mechatronics.
• Fundamental understanding of semiconductor assembly equipment and process.
• Excellent influencing, written and verbal communication skills.
• Strong data analysis capabilities and problem-solving skills.
• Proactive and positive approach towards challenges.
• Ability to work under tight timelines and schedules and perform under pressure.

Good to Have

• Research and Development background from MSc.
• College Graduate or less than 1 year experience.

Job Description:

• Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization
• CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process
• Candidate will focus on Process and Technology Development for New Product (NPI), Shuttle Program, Test Vehicle and Foundry Product.
• Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization
• Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
• Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.
• Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.

Qualifications:

• MSc/MEng/BEng degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics),
• Research and Development background from MSc is preferred.
• Collage Graduate is preferred or less than 1 years experience
• Fundamental understanding of semiconductor assembly equipment and process.
• Excellent influencing, written and verbal communication skills.
• Strong data analysis capabilities and problem-solving skills.
• Proactive and positive approach towards challenges.
• Able to work under tight timelines and schedules, and perform under pressure.