Packaging Module Development Engineer

The Packaging Module Development Engineer at Intel's Advanced Packaging Technology Manufacturing (APTM) division will focus on developing and commercializing industry-leading semiconductor packaging technologies. This role involves innovating First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions, optimizing assembly processes for quality, reliability, cost, and manufacturability, and managing projects to meet product development timelines. The engineer will also provide sustaining support for equipment performance and process health in high-volume manufacturing, collaborating with cross-organizational teams to enhance semiconductor packaging capabilities at scale.

Must Have

• PhD with one or more years in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field
• Minimum GPA of 3.5
• At least one publication in a peer-reviewed technical journal
• Must have the required degree prior to your start date
• Develop First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions
• Collaborate with multifunctional and cross-organizational teams
• Optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability
• Innovate next generation materials, equipment, and fabrication processes
• Manage projects to meet product development timelines
• Apply formal education and judgment to solve technical problems
• Provide sustaining support for equipment performance and process health in high-volume manufacturing
• Respond promptly to foundry customer requests and events
• Regular onsite presence

Good to Have

• Experience in technology development
• Familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Experience delivering results for complex, time-critical technical projects
• Experience in semiconductor fabrication processes and technology
• Previous related work experience in a semiconductor foundry

Perks & Benefits

• Competitive pay
• Stock
• Bonuses
• Health benefits
• Retirement benefits
• Vacation

Job Description:

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:

• Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel’s future packaging platforms.
• Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale.
• Managing projects to meet product development timelines.
• Applying formal education and judgment to solve technical problems.
• Providing sustaining support for equipment performance and process health in high-volume manufacturing.
• Responding promptly to foundry customer requests and events.

The ideal candidate will demonstrate:

• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.

This position requires regular onsite presence.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.

Minimum Qualifications:

• PhD with one or more years in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field.
• Minimum GPA of 3.5.
• At least one publication in a peer-reviewed technical journal.
• Must have the required degree prior to your start date.

Preferred Qualifications:

One or more years of experience in any of the following:

• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Delivering results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technology.
• Previous related work experience in a semiconductor foundry.

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence.