Sr. Principal Foundry Engineer - HV/BCD Device Expert

13 Minutes ago • 10 Years +

Software Development & Engineering

Job Description

The Sr. Principal Foundry Engineer in the APAC Central Competence Team will collaborate with external foundries to ensure stable chip supply for NXP. This role primarily involves driving lead product ramp-up under new technology introduction, managing foundry process transfers, and enabling new fabs. Key responsibilities include qualifying and releasing processes, ensuring manufacturability and yield improvement, interfacing with key customers, and leading projects to support NXP's business needs.

Good To Have:

Good communication skills, with the ability to influence and steer discussions.
Pro-active working attitude, creative, pragmatic, enterprising, and result-driven.
Familiar in managing/working with foundries, maximizing leverage from them.

Must Have:

Close collaboration with foundries, NXP technology groups, business lines, and stakeholders to qualify and release processes.
Owner of front-end process safe launch, driving manufacturability and yield improvement during ramp-up.
Interface with key customers on critical projects.
Lead and steer projects for timely completion to support NXP business needs.
Main decision maker on process integration, balancing technical judgment, resource planning, project schedule, logistics, and supplier relationships.
NTI Process transfers within foundry and with any NXP joint ventures.
Bachelor or MSc in physics or electrical engineering.
>10 years of experience with front-end IC process integration, working in foundries’ production or development teams.
In-depth knowledge of HV/BCD devices and processes.
Strong understanding of yield enhancement techniques and data analysis.
Fluent in English and Mandarin.
Hands-on experience in being a lead; leading teams with responsibilities in development/transfer projects or production ramp-up.

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Description: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI), and within foundry process transfers and new fab enablement

The key areas of responsibility of the jobholder are:

Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process
Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement.
Interface with key customers on critical projects.
Lead and steer the projects towards timely completion to support NXP business needs
Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc
NTI Process transfers within foundry and with any NXP joint ventures

Requirements / preferences:

Bachelor or MSc in physics or electrical engineering.
>10 years of experience with front-end IC process integration, working in foundries’ production or development teams
In-depth knowledge of HV/BCD devices and processes
Strong understanding of yield enhancement techniques and data analysis
Must be fluent in English and Mandarin
Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up.
Good communication skills. Having the ability to influence and steer a discussion
Pro-active working attitude, creative, pragmatic, enterprising and result driven.
Familiar in managing/working with foundries, maximising leverage from foundries