Semiconductor Packaging Engineering Intern - Fall 2025

2 Months ago • All levels
Software Development & Engineering

Job Description

NXP's Technology organization is crucial for delivering high-quality, scalable, and cost-competitive technologies. The Packaging Innovation (PI) team is responsible for implementing packaging solutions for new product introductions and technology development for various business product lines. Interns will assist packaging engineers in defining and validating packages for new NXP products. This may involve lab work for testing and mechanical analysis of packages and materials, using CAD for package definition, or modeling package performance (thermal, mechanical, electrical). The role also involves addressing and resolving design, material, and processing issues that arise during development.
Good To Have:
  • Working knowledge of CAD tools and/or Finite Element Simulation tools
  • Working knowledge of various IC packages (QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out)
  • Knowledge of Statistical Data Analysis (graphing/plotting, Design of Experiment)
  • Knowledge of soldering and intermetallic compounds
Must Have:
  • B.S, M.S. or Ph.D. Candidate in Materials Science, Mechanical Engineering or Electrical Engineering
  • Team player with positive attitude
  • Self-driven with good communication and presentation skills
  • Willingness to learn and apply fundamental knowledge
  • Working knowledge of MS Office tools (PowerPoint, Word, Excel)

Add these skills to join the top 1% applicants for this job

ms-office
communication
excel
team-player
data-analytics
cad-computer-aided-design
game-texts

NXP’s Technology (CTO) organization plays an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers.

The Packaging Innovation (PI) organization in CTO is responsible for the implementation of packaging solutions for new product introduction and new technology development for electronic packages for the varied business product lines.

Job Summary:

  • Work with packaging engineers to help define and validate packages used for new products for NXP. 
  • Potential working in the lab to perform tests and mechanical analysis to evaluate packages and materials used in microelectronic packages.
  • Potential working with the design team using CAD to define packages that will be used for new products.   
  • Potential working with Package Innovation team modeling package performance (thermal, mechanical, electrical)
  • Address and solve design, materials and processing issues that may occur during the development process.

Job Qualifications:

  • B.S, M.S. or Ph.D. Candidate in Materials Science, Mechanical Engineering or Electrical Engineering.
  • Ability to be a team player with positive attitude, self-driven, with good communication and presentation skills (both written and verbal).
  • Willingness to learn new concepts and apply fundamental knowledge to engineering problems. 
  • Working knowledge of MS Office tools like PowerPoint, Word, Excel is required.
  • Working knowledge of CAD tools and/or Finite Element Simulation tools is a plus.
  • Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
  • Knowledge of Statistical Data Analysis incl. graphing/plotting and Design of Experiment is a plus.
  • Knowledge of soldering and intermetallic compounds is a plus.

In order to be considered for an internship with NXP, you must be returning to school (or graduating) at the conclusion of the internship term. If you are graduating prior to Dec 2025, please apply for positions labeled “Graduate Hire” or “Entry Level”.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

#LI-e41b

Set alerts for more jobs like Semiconductor Packaging Engineering Intern - Fall 2025
Set alerts for new jobs by NXP
Set alerts for new Software Development & Engineering jobs in United States
Set alerts for new jobs in United States
Set alerts for Software Development & Engineering (Remote) jobs
Contact Us
hello@outscal.com
Made in INDIA 💛💙