Datacenter Substrate engineering, Sr Engineer

12 Hours ago • 8 Years +

Network Engineering

Job Description

Qualcomm's Package Engineering Team seeks a highly motivated Datacenter Substrate Engineer. This role focuses on developing next-generation substrates for AI and server packages, defining architecture, design rules, and specifications. Responsibilities include competitive analysis, roadmapping, advanced package substrate development (SiP, FCBGA, FCCSP), defining process flows, design rules, and specifications. The engineer will lead supplier collaborations, drive DFM, and define root cause/corrective actions for quality issues, working cross-functionally with various engineering and product teams.

Good To Have:

Master's degree in material science/chemical/mechanical/electrical engineering.
Over 10 years of hands-on experience working in IC packaging substrate manufacturing factory (SiP, FCBGA, FCCSP).
Understanding of organic laminate raw materials, manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.
Knowledge in DOE, control plan, FMEA, SPC and other statistical process control methods.
Proficiency in material and characterization data analysis, and statistical data analysis using tools like JMP and Minitab.
Knowledge of package reliability test methods and qualification procedure.
Working knowledge of package assembly process flow.
Proficiency to analyze any photos or results taken by FA tools (Optical microscopes, SEM, C-SAM, FIB, EDX, X-ray, EPMA, TDR, …).
Strong team player & project management skills.
Good verbal and written communication/language skills.

Must Have:

Working with Marketing/IC/product teams on competitive analysis and road mapping package technology for future products.
Responsible for advanced package substrate development (SiP, FCBGA, FCCSP).
Responsible for defining Datacenter Substrate process flows, design rules and specifications.
Responsible for leading and co-working package substrate suppliers to enable new product launches.
Working with internal design team and driving DFM for next generation of Datacenter Substrates.
Responsible for defining root cause and corrective actions when quality issues happen during development period.
Bachelor's degree in material science/chemical/mechanical/electrical engineering and 8+ years of substrate process and/or integration, or related work experience.
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.

Perks:

Qualcomm offers a world-class health benefit option providing world-class coverage to employees and their eligible dependents.
Our programs are designed to help employees build and prepare for a financially secure future.
Our self and family resources help you build emotional/mental strength and resilience, as well as define your purpose — in life and at work.
Qualcomm’s wellbeing programs and resources offer support to help employees Live+Well and Work+Well, so they can unlock their full potential at home, at work, and everywhere between.
continuous learning and development programs
tuition reimbursement
mentorships

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Job Description

Job Posting Date

2025-10-14

***

Company:

Qualcomm Korea YH

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm's Package Engineering Team has an opening for Datacenter Substrate Engineer position. This team is responsible for next generation of Substrate for Datacenter package, especially various types of AI & Sever package. Team is participating in paving roadmaps, defining architecture, design rules and specifications for Datacenter Substrate. We are seeking a highly motivated engineer who will collaborate within a team and work with cross-functionally with planners, designers, assembly engineers, quality engineers and suppliers.

Responsibilities:

Working with Marketing/IC/product teams on competitive analysis and road mapping package technology for future products.
Responsible for advanced package substrate development (SiP, FCBGA, FCCSP).
Responsible for defining Datacenter Substrate process flows, design rules and specifications.
Responsible for leading and co-working package substrate suppliers to enable new product launches.
Working with internal design team and driving DFM for next generation of Datacenter Substrates.
Responsible for defining root cause and corrective actions when quality issues happen during development period.

Minimum qualifications:

Bachelor's degree in material science/chemical/mechanical/electrical engineering and 8+ years of substrate process and/or integration, or related work experience.

Preferred qualifications:

Master's degree in material science/chemical/mechanical/electrical engineering.
Over 10 years of hands-on experience working in IC packaging substrate manufacturing factory (SiP, FCBGA, FCCSP).
Understanding of organic laminate raw materials, manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.
Knowledge in DOE, control plan, FMEA, SPC and other statistical process control methods.
Proficiency in material and characterization data analysis, and statistical data analysis using tools like JMP and Minitab.
Knowledge of package reliability test methods and qualification procedure.
Working knowledge of package assembly process flow.
Proficiency to analyze any photos or results taken by FA tools (Optical microscopes, SEM, C-SAM, FIB, EDX, X-ray, EPMA, TDR, …).
Strong team player & project management skills.
Good verbal and written communication/language skills.

Minimum Qualifications:

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

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