HBM Integration Engineer

Broadcom's ASIC Product Division is seeking an HBM Integration Engineer to provide top-tier technical engineering support for custom silicon ASIC products incorporating Broadcom’s High Bandwidth Memory (HBM) PHY IP. This role involves working directly with customers, debugging issues through hands-on lab work, collaborating with design and software teams, and defining manufacturing test improvements. The engineer will develop a deep understanding of HBM IP, characterize memory performance, and resolve HBM DRAM issues with memory suppliers.

Must Have

• Develop a detailed understanding of Broadcom's HBM IP.
• Work directly with Broadcom’s ASIC customers on custom silicon products.
• Develop scripts and run characterization shmoos to isolate issues.
• Design automated bench level device testing procedures.
• Work closely with HBM IP design teams to root cause HBM issues.
• Work with memory suppliers to support resolution of HBM DRAM issues.
• Define and implement manufacturing test improvements for HBM DRAM or PHY defects.
• Generate comprehensive test reports.
• Experienced in DDR memory interfaces including the PHY, controller and embedded test capability.
• Experience developing DRAM memory tests and characterization.
• Knowledge of different types of memory tests.
• Understanding of the fundamentals of VLSI IC I/O & control, and built-in self-test (BIST).
• General knowledge of semiconductor technology and ASIC design flow including Verilog simulation and timing analysis.
• Experience with state-of-the-art lab test equipment used for evaluating memory interfaces.
• Extensive programming experience in at least one of Ruby, C, C++, Perl, or Python.
• Experience with Linux and Bash scripting.
• Strong debugging skills.

Good to Have

• Direct experience with HBM memory system and test.
• Verilog experience.
• Working knowledge with AI tools such as Chat GPT, Gemini, and/or Cursor.

Perks & Benefits

• Discretionary annual bonus
• Equity in accordance with equity plan documents and equity award agreements
• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• Company paid holidays
• Paid sick leave
• Vacation time
• Paid Family Leave and other leaves of absence

Job Description:

Broadcom’s ASIC Product Division (APD) is focused on enabling customers to develop products with a sustainable and substantial competitive advantage. APD does this by delivering best in class technology platforms, easy to integrate bleeding edge intellectual property, and by providing world class customer support. APD’s customers span a wide range of industries developing ASICs for the largest and most complex cloud computing AI engines, supercomputers, and networking, through to low power and the most advanced wireless solutions as examples.

Job Description:

The HBM Integration Engineer is responsible for delivering top-tier technical engineering support for custom silicon ASIC products that incorporate Broadcom’s High Bandwidth Memory (HBM) PHY IP with HBM DRAM memory modules. This role requires the successful candidate to work directly with Broadcom's ASIC customers, serving as the liaison with the DRAM supplier. Key activities include hands-on lab work for testing and debugging issues, collaborating with the design and software teams, and providing expert test recommendations.

This individual must be highly motivated and capable of working independently or as part of a team. Expertise in DDR memory system development and debug is required. Expertise in HBM, DRAM manufacturing test and in-system DRAM test is also desirable. This position is located in Fort Collins, CO.

Typical Duties Include:

• Develop a detailed understanding of Broadcom's HBM IP, how to control and evaluate the IP, and understand the interplay of the memory performance at the ASIC and system levels.
• Work directly with Broadcom’s ASIC customers on their custom silicon products during design, bring-up, as well as debugging performance or HBM memory issues.
• Develop scripts and run characterization shmoos to isolate issues.
• Design automated bench level device testing procedures by utilizing programmable test equipment and HBM IP built-in test functions.
• Work closely with the HBM IP design teams to root cause HBM issues.
• Work with memory suppliers to support the resolution of HBM DRAM issues or defects.
• Work with HBM suppliers as well as Broadcom’s physical analysis teams as necessary to pinpoint failures.
• Work with memory suppliers, design teams, and Broadcom’s manufacturing teams to define and implement manufacturing test improvements for HBM DRAM or PHY defects.
• Generate comprehensive test reports with clear analysis methods that highlight the relationships between stimulus / setup conditions and device performance.

Education/Experience:

• A Bachelor’s Degree in Electrical or Computer Engineering or equivalent, and 5+ years of relevant experience in DDR memory system design, validation, bring-up and debugging; or Masters degree and 3+ years of relevant experience.

Required Skills:

• Experienced in DDR memory interfaces including the PHY, controller and embedded test capability. Direct experience with HBM memory system and test is a plus.
• Experience developing DRAM memory tests and characterization desired. Knowledge of different types of memory tests is a must.
• Understanding of the fundamentals of VLSI IC I/O & control, and built-in self-test (BIST).
• General knowledge of semiconductor technology and ASIC design flow including Verilog simulation and timing analysis. Verilog experience is a plus.
• Experience with state-of-the-art lab test equipment used for evaluating memory interfaces including sampling scopes, real time scopes, function generators and logic analyzers.
• Extensive programming experience in at least one of the following languages: Ruby, C, C++, Perl, or Python
• Experience with Linux and Bash scripting
• Strong debugging skills are a must

Additional Requirements:

• Strong verbal, written communication, and presentation skills.
• Team player who can easily work with different personalities and skill levels.
• Ability to multitask and manage multiple technical issues in parallel.
• Well organized, methodical, and detail oriented.
• Must develop, accurately track, and meet commitments to product characterization or engineering development schedules.
• Some minimal travel time may be required.
• Working knowledge with AI tools such as Chat GPT, Gemini, and/or Cursor

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $91,000 - $146,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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