Internship Engineer: Analog/Mixed-Signal Design M/F
Job Description
- Work on design and architecture studies in analog and mixed-signal.
- Analyze efficient SoC adaptive supply/biasing schemes.
- Optimize computing performance and power consumption.
- Study techniques like adaptive voltage scaling, body biasing, process and temperature monitoring.
- Propose architecture studies to balance hardware, process, and software complexity.
- Opportunity to acquire experience with cutting-edge microelectronics processes.
- Work in a highly technically skilled team.
- International, friendly, and healthy working environment.
- Deep expertise in Analog/Mixed signal systems design in advanced process nodes.
- Career development opportunities through online and offline learning.
- Commitment to sustainability, diversity, inclusion, and equality.
Context
We are looking for an intern candidate for two to three months to work on design and architecture studies in our analog and mixed-signal team in the Automotive Microcontrollers engineering division.
You will have the opportunity to acquire experience with cutting edge process in microelectronics, helping on the development of circuits aiming best tradeoffs between high performance and power efficiency.
You will be part of a highly technically skilled team, in an international, friendly and healthy working environment. The team has deep expertise in design of Analog/Mixed signal systems in advanced process nodes.
The Internship:
The apprentice will be working on technical solutions according to the following internship subject:
Analysis of efficient SoC adaptative supply/biasing schemes to reach optimal tradeoff between computing performance and power consumption.
GOAL = Architecture Studies & Proposals to reach the right balance between embedded HW resources, process capabilities and the SW complexity to exploit them. Context is the push towards power efficient NXP MCU and Crossovers (eg recent GF22FDXP RT2660/RT2770 platform under design).
Technics like adaptative voltage scaling, forward or reverse body biasing (based on the IP recently developed for RT2660 in 22fdsoi node), process and temperature monitoring, are example of HW bricks to be considered and used in this study.
