Senior Program Manager – Advanced Packaging & Technology Development

The Senior Program Manager – Advanced Packaging & Technology Development (APTD) will lead strategic initiatives, driving operational excellence and ensuring alignment with APTD’s mission to accelerate yield maturity, technology transfer, and future packaging innovations. This role involves leading the full lifecycle of APTD programs, defining objectives, and managing cross-functional teams. Key responsibilities include developing PMO methodologies, leading CapEx/OpEx planning, ensuring compliance, aligning program goals with analytics and simulation, driving team engagement, and tracking critical metrics for program success and accountability.

Must Have

• Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure.
• Define program objectives, deliverables, resource plans, and success metrics.
• Lead cross-functional teams across PDE, CPI, DRAM, and NPI to ensure timely, high-quality delivery of critical initiatives.
• Develop and implement standardized PMO methodologies, tools, and templates.
• Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems.
• Ensure compliance with internal governance standards and external customer requirements.
• Align program goals with APTD’s charter to embed analytics and simulation into development workflows.
• Drive team member engagement across BU, PDT, TPM, and central engineering teams.
• Provide leadership with regular updates on program status, risks, and mitigation strategies.
• Define and track critical metrics for program success, yield reporting, and EOL accountability.
• Conduct program reviews to assess outcomes and bring together lessons learned.
• Mentor project managers and foster continuous improvement across PMO practices.
• Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field.
• 8+ years of experience in semiconductor packaging, process integration, or technology development.
• Proven record leading complex, cross-functional programs in a high-tech environment.
• Solid understanding of advanced packaging flows (e.g., hybrid bonding, CoWoS, chiplet integration).
• Outstanding communication, leadership, and stakeholder management skills.

Perks & Benefits

• Paid Time Off
• Continuous Learning
• Wellness Programs
• Stock Purchase Program
• Health Insurance
• Recognition

Role Summary

The Senior, Program Management – Advanced Packaging & Technology Development (APTD) will lead strategic initiatives across the APTD organization, driving operational excellence and ensuring alignment with APTD’s mission to accelerate yield maturity, technology transfer, and future packaging innovations. This role establishes governance frameworks, oversees program execution, and develops cross-functional collaboration to deliver high-impact results.

Key Responsibilities

Program & Project Leadership

• Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure.
• Define program objectives, deliverables, resource plans, and success metrics.
• Lead cross-functional teams across PDE, CPI, DRAM, and NPI to ensure timely, high-quality delivery of critical initiatives.

Governance & Operational Excellence

• Develop and implement standardized PMO methodologies, tools, and templates.
• Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems.
• Ensure compliance with internal governance standards and external customer requirements.

Strategic Alignment & Communication

• Align program goals with APTD’s charter to embed analytics and simulation into development workflows.
• Drive team member engagement across BU, PDT, TPM, and central engineering teams.
• Provide leadership with regular updates on program status, risks, and mitigation strategies.

Performance & Accountability

• Define and track critical metrics for program success, yield reporting, and EOL accountability.
• Conduct program reviews to assess outcomes and bring together lessons learned.
• Mentor project managers and foster continuous improvement across PMO practices.

Qualifications

• Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field.
• 8+ years of experience in semiconductor packaging, process integration, or technology development.
• Proven record leading complex, cross-functional programs in a high-tech environment.
• Solid understanding of advanced packaging flows (e.g., hybrid bonding, CoWoS, chiplet integration).
• Outstanding communication, leadership, and stakeholder management skills.
• Experience with IIoT hardware deployment and APC systems.
• Familiarity with frameworks such as PDE, CPI, and NPI.
• Knowledge of simulation modeling, yield improvement, and defectivity analysis.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

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