This position is a packaging back-end R&D intern, focusing on IC (integrated circuit) packaging technology research and development. The intern will collaborate with global teams to complete development projects and other tasks, including new packaging technology development, new package-related process development, advanced material interface study, advanced IC package failure analysis, and coordinating/leading development projects independently. The role also involves communication and cooperation among global teams in the US, Europe, Malaysia, Japan, and France.
Good To Have:- CET-6 English level preferred
Must Have:- Pursuing a Master's degree
- Major in Metallic Materials Engineering, Polymer Materials Engineering, Mechanical Engineering and Automation
- CET-4 or equivalent English level
- Ability to work in a cross-functional/global team
- Independent R&D capability