Thermal/Mechanical Engineer
Job Summary
Job Description
We are seeking a motivated Mechanical/Thermal Engineer to conduct thermal and mechanical analysis and testing on electronic components for Rivos hardware. Responsibilities include collaborating with vendors on product development, building liquid and air-cooling test setups, performing thermal and mechanical testing, designing and characterizing microchannel cold plates, and conducting wind tunnel measurements for enclosure impedance and flow rate data. The role also involves compiling test data, generating reports, performing transient thermal modeling of packages for thermal/power management, and supporting mechanical design at board and chassis levels. Candidates will run CFD/FEA simulations using tools like Icepak and Ansys Mechanical, and perform board-level reliability analysis for thermomechanical integrity and lifetime predictions.
Must have:
- 3-5 years experience in product development, thermal simulation, testing, and validation in electronics/semiconductor industry.
- B.S. degree in Mechanical/Thermal Engineering.
- Good communication and interpersonal skills.
- Proficiency with FEA and CFD simulations (Icepak, Ansys Mechanical).
- Hands-on experience with lab equipment and machinery.
- Experience implementing test plans with attention to detail.
- Ability to use and interpret data from DAQ systems.
Good to have:
- 1 year relevant experience with an advanced degree.
- Familiarity with LabView or scripting.
- Familiarity with network equipment.
- Familiarity with ANSYS Electronic Desktop.
6 skills required
Job Details
We are looking for a highly motivated Mechanical/Thermal Engineer that will mainly be responsible for performing thermal and mechanical analysis and test on electronic components at various scales of Rivos hardware equipment. This position will report to the Thermal/Mechanical Engineering Manager.
What will you do?
- Responsibilities for this position include but not limited to:
- Working with vendors to develop mockups, test samples and high-volume products.
- Build liquid and air-cooling test setup and procedures.
- Thermal and mechanical testing of the test boards.
- Microchannel cold plate design, test and characterization.
- Wind tunnel measurements to produce Impedance and flow rate data for Rivos enclosures.
- Compile test data and generate reports.
- Transient thermal modeling of Rivos packages for thermal/power management.
- Support mechanical design at the board and chassis levels.
- Run CFD/FEA simulations (Icepak, Ansys Mechanical) and board level reliability analysis (Sherlock) for thermomechanical integrity and lifetime predictions.
Desired Skills and Experience:
- B.S. degree in Mechanical/Thermal Engineering with minimum 3-5 years of experience in product development, thermal simulation, testing and validation in electronics/semiconductor industry, or 1 year of relevant experience with an advanced degree.
- Team player with good communication and interpersonal skills.
- Passionate for working in a startup environment.
- Enthusiastic about exploring, learning new techniques and applying them to simulations/analysis and design.
- Experience with fan, server and networking enclosures test setups.
- Experience with liquid cooling systems and testing.
- Experience with airflow and wind tunnel measurements.
- Proficient MCAD user (Solidworks and/or CREO preferred).
- Proficient with Python.
- Experience with FEA and CFD simulations (Icepak, Ansys Mechanical and related Ansys suite of tools preferred).
- Good knowledge/use of MS or Google Office Suite is a must.
- Hands on with tools, lab equipment and comfortable working with various types of machinery.
- Familiarity with carrying out various types of measurements and acquiring data on mockups and other Rivos hardware equipment (strain gauges, stress measurements, temperature measurements, metrology etc.)Implementing test plans: setting up and conducting tests or experiments with attention to detail.
- Ability to use and interpret data from DAQ systems, perform analyses and data reduction and communicate/present to the Platform HW team.
Optional Skills:
- Familiarity with LabView (and/or scripting a plus).
- Familiarity with network equipment, config and setup.
- Familiarity with ANSYS Electronic Desktop.
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