Account Sales III - (S3)

Applied Materials is a global leader in materials engineering solutions for chip and display production, enabling technologies like AI and IoT. This role is for a strategic account owner for TSMC’s advanced technology nodes and packaging solutions, driving business growth and strengthening partnerships. It focuses on Varian (Implant) systems or Advanced Packaging technologies, requiring strong technical knowledge, customer engagement, and strategic execution to align capabilities with customer needs.

Must Have

• Act as the primary interface for TSMC on Varian implant tools OR Advanced Packaging applications.
• Develop and implement account strategies to support technology transitions.
• Lead negotiations on tool bridging, warranty extensions, and resource planning for fab ramp-up and high-volume manufacturing.
• Consolidate risk assessments and opportunity applications across multiple nodes.
• Coordinate new tool introductions, NSO (New System Orders), and relocation requirements for advanced fabs.
• Engage with TSMC R&D teams to influence design-to-order (DTO) decisions.
• Present Applied Materials’ product roadmap and capabilities; communicate customer requirements to internal product teams.
• Prepare and negotiate pricing proposals, manage order booking, and monitor account receivables.
• Maintain detailed documentation of customer interactions, visit summaries, and action plans.
• M.S. or B.S. degree in Engineering or related field.
• 2+ years of semiconductor sales experience with DDP, CMP, ETCH, IMP, MDP, PDC, FEP tools.
• Proven experience in technical sales or account management, preferably with TSMC or semiconductor industry customers.

Perks & Benefits

• Supportive work culture that encourages learning, development, and career growth
• Empowerment to push the boundaries of what is possible
• Learning every day in a supportive leading global company
• Programs and support for health and wellbeing
• Programs that encourage personal and professional growth
• Competitive and comprehensive total rewards program
• Employee Assistance Program
• Meditation and family support resources
• Travel insurance
• Free career development and mentoring programs
• Technical and professional courses
• Worldwide "Giving" program with matched employee contributions by Applied Materials Foundation

Job description

Job ID

R2518908

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:

Hsinchu,TWN

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

As the strategic account owner for TSMC’s advanced technology nodes and packaging solutions, you will drive business growth and strengthen partnerships by aligning Applied Materials’ capabilities with customer needs. This role focuses on Varian (Implant) systems OR Advanced Packaging technologies, requiring strong technical knowledge, customer engagement, and strategic execution.

Key Responsibilities

• Act as the primary interface for TSMC on Varian implant tools OR Advanced Packaging applications, ensuring Applied Materials secures opportunities in advanced nodes and packaging technologies.
• Develop and implement account strategies to support technology transitions.
• Lead negotiations on tool bridging, warranty extensions, and resource planning for fab ramp-up and high-volume manufacturing.
• Consolidate risk assessments and opportunity applications across multiple nodes; ensure Applied Materials maintains competitive positioning.
• Coordinate new tool introductions, NSO (New System Orders), and relocation requirements for advanced fabs.
• Engage with TSMC R&D teams to influence design-to-order (DTO) decisions.
• Present Applied Materials’ product roadmap and capabilities; communicate customer requirements to internal product teams.
• Prepare and negotiate pricing proposals, manage order booking, and monitor account receivables.
• Maintain detailed documentation of customer interactions, visit summaries, and action plans; ensure timely execution.

Requirements

• M.S. or B.S. degree in Engineering or related field.
• 2+ years of semiconductor sales experience with one or more of the following tools: DDP, CMP, ETCH, IMP, MDP, PDC, FEP.
• Proven experience in technical sales or account management, preferably with TSMC or semiconductor industry customers.
• Strong interpersonal and communication skills with ability to influence at all levels.
• Excellent English communication and presentation skills.
• Ability to travel as needed (approx. 20%).

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Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Relocation Eligible:

No