As a Staff Engineer Package Design for Power Semiconductor Modules at Infineon Technologies Bipolar GmbH & Co. KG, you will combine precise mechanical design with an eye for economic efficiency and quality. Your role involves mechanical design and construction of power semiconductor modules and their components, defining housing components, and developing cost-efficiency measures. You will create drawings and CAD models, consider manufacturability, and lead or participate in development projects, collaborating closely with various departments, suppliers, and customers.

Must Have

• Mechanical design and construction of power semiconductor modules in solder-bond technology and their components
• Definition and construction of housing components (connections, plastic parts, substrates, base plates, etc.)
• Development and implementation of cost-efficiency measures regarding materials and processes (Design to Cost, Design for Manufacturing)
• Derivation of product properties from specifications and relevant standards
• Creation of drawings and CAD models for manufacturing, simulation, suppliers, and customers
• Consideration of manufacturability requirements in large quantities, e.g., through statistical tolerance considerations
• Participation in development projects and leadership in individual projects, as well as close cooperation with specialist departments, suppliers, and customers

Good to Have

• Knowledge in plastic injection molding and/or assembly and interconnection technology

Perks & Benefits

• Career development & learning: About 17,000 free LinkedIn Learning courses in 10 languages, Mentoring & Coaching programs, Global Onboarding process as well as Virtual & f2f trainings
• Time & flexibility: Flexible working hours & part-time work, Mobile work (specifications based on job profile and local requirements), Remote work from abroad / Workation (EU), Sabbatical (EU)
• Health & wellbeing: Health activities & programs, Health & Well-being LinkedIn Learning Journey, Health & Well-being Community
• Your working environment: Employee events, Open & global community e.g. cross-site exchange through the virtuality of all meetings, Open office spaces
• Rewards & benefits: Fair and transparent remuneration, Success participation, Performance-related recognition, customised benefit packages

WeAreIn

Join the thinkers, doers, and problem solvers who are working on the technologies of tomorrow. As a Staff Engineer Package Design (f/m/div) for Power Semiconductor Modules at Infineon Technologies Bipolar GmbH & Co. KG, you combine creativity and technical know-how to shape the future of technology, drive groundbreaking projects, and make new ideas a reality. Are you in?

Your Role

As a Staff Engineer Package Design (f/m/div) for Power Semiconductor Modules at Infineon Technologies Bipolar GmbH & Co. KG, you combine precise mechanical design with an eye for economic efficiency and quality – and thus contribute decisively to ensuring that our modules work reliably and efficiently.

Main Activities

• Mechanical design and construction of power semiconductor modules in solder-bond technology and their components
• Definition and construction of housing components (connections, plastic parts, substrates, base plates, etc.)
• Development and implementation of cost-efficiency measures regarding materials and processes (Design to Cost, Design for Manufacturing)
• Derivation of product properties from specifications and relevant standards
• Creation of drawings and CAD models for manufacturing, simulation, suppliers, and customers
• Consideration of manufacturability requirements in large quantities, e.g., through statistical tolerance considerations
• Participation in development projects and leadership in individual projects, as well as close cooperation with specialist departments, suppliers, and customers

Your Profile

Qualifications and Skills that will help you succeed

• Completed degree in Mechanical Engineering or comparable education; ideally knowledge in Electrical Engineering/Power Electronics
• At least three years of professional experience in constructive development, especially in the design of solder-bond modules
• Knowledge in plastic injection molding and/or assembly and interconnection technology is desirable
• Proficient in MS Office, SAP/R3, Vault, and Inventor
• Very good German and good English skills
• Willingness to travel occasionally (to production sites and suppliers)

Contact:

Andreas Pidde, LinkedIn

WeAreIn for driving decarbonization and digitalization.

As a globally leading provider of semiconductor solutions for Power Systems and IoT, we enable groundbreaking solutions for green and efficient energy, clean and safe mobility, and intelligent and secure IoT. Together, we drive innovation and the success of our customers. At the same time, we care for our employees and empower them to achieve their ambitious goals. Help us make life simpler, safer, and more sustainable. Are you in?

Our goal is to create the best Infineon for everyone. We stand for a diverse and inclusive culture and welcome everyone as they are. At Infineon, we offer a work environment characterized by trust, openness, respect, and tolerance. We are committed to providing equal opportunities to all applicants and make our hiring decisions based on the experience and skills of the applicants. Learn more here about our various contact options. We look forward to your resume, even if you do not fully meet all the requirements of the job advertisement. Please let us know if you require any specific arrangements to participate in the hiring process. We are happy to help you. Here you can find more information about Diversity & Inclusion at Infineon.