Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.
We are seeking experienced product engineers to contribute to the development, optimization, and implementation of component-level test strategies for our next generation NAND Flash memory products. This role is critical in ensuring that our NAND products meet the necessary specifications and quality standards before they reach the market. This is an excellent opportunity for experienced engineers seeking to work on industry leading QLC NAND technology critical for building datacenter storage solutions in the AI era.
Major responsibilities include:
Develop burn-in and high speed I/O test specs, methodologies, and validation plans for NAND flash memory components.
Work closely with test development engineers to validate and deploy test flows on high volume manufacturing platforms, enabling teams to assess functionality, performance, and reliability of NAND components.
Analyze test data to identify trends, anomalies, and areas for improvement in product design or manufacturing processes.
Optimize test methodologies to improve test coverage, efficiency, and cycle time.
Provide technical expertise and support for yield enhancement and failure analysis activities.
Collaborate with design, process, and reliability engineering teams to troubleshoot and resolve complex test failures.
This position is associated with the sale of Intel's NAND memory and storage business to SK. This transaction will enhance the resources and potential of the business' storage, and you will be joining a world-class team that will transition to lead the SSD business at SK group. We will keep you informed updates and steps related to this transaction.
Minimum Qualifications:
Degree's and Master's degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit Design, or related fields.
4+ years of experience in logic/memory product engineering or test engineering.
Proficient in statistical data analysis and electrical failure analysis to segment and determine root cause of test failures.
Knowledge of NAND Flash memory technology, including architecture and operation.
Functional knowledge of burn-in and high speed I/O test platforms and architectures.
Excellent communication and teamwork abilities, with experience working in a multi-disciplinary engineering environment.
Proven track record of technical leadership and ability to work independently.
Preferred Qualifications:8+ years of experience in memory product/test engineering, with majority of it in NAND Flash.Experienced in defining burn-in/high speed I/O test specs and methodologies on multiple logic/memory products from TD phase to mass production phase.Extensive experience in development/validation/optimization of high speed I/O testing methodologies, with consideration of fabrication process and design corners.
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