RF Assembly Process Engineer

1 Year ago • 3-6 Years
Manufacturing

Job Description

RF Assembly Process Engineer needed for NXP in Kuala Lumpur. 3-6 years experience in Semiconductor industry with hands-on experience in Die Sort, Stealth Dicing, SMT, Die Attach, and AOI is preferred. Knowledge of SPC, Process Control, Statistics, and DMAC problem-solving skills is a plus. Must have strong analytical thinking, problem-solving, and interpersonal skills.
Good To Have:
  • Stealth Dicing
  • SMT
  • AOI
  • SPC
Must Have:
  • Semiconductor Industry
  • Die Sort
  • Die Attach
  • Problem Solving

Add these skills to join the top 1% applicants for this job

team-player

Roles and Responsibilities

  • Responsible for Quality, Yield, Cost and Productivity improvement activities related to Pre-Assembly and Die Attach process in RF Assembly
  • Partner with manufacturing and equipment team to support delivery, work on daily production line issues, drive quality and operational excellence
  • Responsible for process yield improvements and LOH reduction through systemic problem solving and identifying solutions to baseline issues
  • Collaborate with API for Pre-Assembly and die attach process and material optimization
  • Partner with supplier, vendor, procurement to work on productivity and cost improvement projects for the operation
  • Support NTI/NPI qualification, apply lesson learnt and ensure smooth transition to high-volume manufacturing
  • Responsible for FMEA, Control Plan, OCAP and SWE as documentation owner and to drive enhancement and compliance
  • Work on strategic industrialization plan, automation and quality firewall implementation
  • Collaborate with cross functional team to improve manufacturing robustness and process stability
  • Support internal and external audit, drive compliance to requirements

Profile

  • Bachelor’s Degree in Engineering Discipline (Material Science/Electrical/Mechanical or equivalent)
  • 3-6 years of working experience in Semiconductor industry with hands-on experience in Die Sort, Stealth Dicing, SMT, Die Attach, AOI is an added advantage
  • Knowledge on SPC, Process Control, Statistics and DMAC problem-solving skills would be preferable
  • Good knowledge in material science especially metallurgy
  • Technically competent, data driven and hands-on with strong analytical thinking and good in problem solving
  • Has the desire to learn, take up new challenges, consistently challenge status quo and eager to strive for success
  • Strong interpersonal skills, a good team player with ability to work independently and resourceful
  • Able to multi-tasks, work under pressure and tight dateline and comfortable working in a fast-paced environment


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