Job Details:

Job Description: 

This position is an opportunity to become a part of the Intel Wafer-Level advanced packaging development team in Assembly and Test Technology Development.  This organization is responsible for developing advanced packaging solutions for 2.5, 3, and 3.5D integration of devices for Intel Foundry customers.  As a part of this team you will be at the forefront of this rapidly growing area in the industry, driving technology solutions to market that are state-of-the-art.

• Leads a team of module development engineers to drive technology development and enablement, provide integrated process solutions, and perform feasibility studies to meet desired device specifications while maximizing safety, quality, and process capabilities of wafer processing, assembly/test, and module repair factories.

• Ensures execution of module improvement responsibilities such as equipment ownership and oversees process and equipment in a manufacturing line.

• Leads growth of manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to manufacturing sites across the globe.

• Drives cross organizational alignment towards process pathway solutions.

• Deeply partners with integration, device, and yield engineering teams to build robust process solutions that will help deliver to power performance and area leadership with technology structural cost in mind.

• Partners with supplier executive management to identify, nurture, develop, and implement unique research/industry ideas to life.

• Coaches and leads engineering teams to reverse engineer and/or develop repair and improvement opportunities to improve cost, output, and yield. Hires, manages, and coaches engineers in pathfinding and technology road mapping for advanced and future technology development, building a holistic view for subject matter expertise.

• Develops long-term strategies for module engineering capabilities to support future requirements.

• Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.

• Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• BS degree and 7+ years' relevant experience or MS degree with 5+ years' relevant experience or PhD degree with 4+ year' relevant experience.

• Hands-on experience in semiconductor wafer or assembly process, equipment, or materials development.

• Experience with process development methodology, project management and objective based schedule management.

Preferred Qualifications:

• Direct experience in wafer level assembly or wafer level packaging research and development for processes, equipment, and materials

• Experience in program/project management for advanced packaging at a major semiconductor manufacturer

• Strong technical leadership demonstrated in process development for wafer fabrication or assembly/test manufacturing

• Experience specifically working on hybrid bonded interconnects (HBI), RDL based packaging, and/or ultra-fine pitch solder connections.

• Demonstrated capability to lead programs in development from early phases of strategy formation and planning all the way to high-volume production and sustaining

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US:

$179,900.00-$253,980.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.