Senior Staff Advanced Packaging Engineer

1 Month ago • 5 Years +

About the job

SummaryBy Outscal

Lead advanced package development for next-gen data center applications at Marvell. Requires 5+ years of experience in package technologies, materials, design rules, and assembly rules. Must be able to lead cross-functional teams and interface with package suppliers.

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

Marvell is seeking a talented package development leader to contribute to the strategic development of advanced packages for next generation data center applications.

What You Can Expect

This engineer will be responsible for leading small project teams of design and simulation engineers to deliver innovative high quality packaging solutions.  The engineer will also interface with package suppliers to select package technology to ensure manufacturability, and compliance with performance, reliability, and cost requirements.

*This is a hybrid role requiring a minimum of 2 days per week on site in Burlington, VT.

What We're Looking For

Requirements

Bachelor’s degree in Computer Science, Electrical Engineering or related fields and a minimum of 5 years of related professional experience.

Job Requirements

  • Must have a proven ability to lead development projects involving various cross functional teams like assembly development, physical layout teams, and other related disciples

  • Must have familiarity with packaging technologies, materials, package substrate design rules and assembly rules

  • Ideal candidate would have familiarity with Cadence design tools

  • Ideal candidate would have experience with high-speed electronic packaging for digital and analog ICs

  • 2.5D & 3D package development experience is highly desired

  • Understanding, debugging and simulations of EMI/EMC problems is also highly desired

  • Knowledge of the thermal and mechanical analysis of the IC package development is a plus

Expected Base Pay Range (USD)

146,900 - 217,340, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements 

At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process.

This role is eligible for our hybrid work model in which you will be able to split time between working from home and on-site in a Marvell office.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

#LI-TD1
$146.9K - $217.3K/yr (Outscal est.)
$182.1K/yr avg.
Burlington, Vermont, United States

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