Silicon Engineering Lead

1 Month ago • 8-12 Years • Research & Development • Manufacturing

Job Summary

Job Description

This Silicon Engineering Lead role at Google Cloud in Taipei, Taiwan involves designing and building custom silicon solutions for Google's products. Responsibilities include managing a team, developing relationships with HVM suppliers (foundries, OSATs), ensuring quality and delivery metrics are met, providing first-line support for engineering issues during high-volume manufacturing (HVM), and meeting yield, cost, and quality requirements. The role requires expertise in silicon product engineering, test engineering, and high-performance computing chips in advanced technology nodes. The successful candidate will work to deliver finished goods according to schedules and volumes, partnering with the Silicon Operations team.
Must have:
  • 8+ years experience with SoC/ASIC production
  • 3+ years people management experience
  • Experience with HVM supply chain management
  • Expertise in high-performance computing chips
Good to have:
  • Master's degree in related field
  • 12+ years silicon product engineering experience
  • Experience with wafer foundries and OSAT companies
  • Ability to deliver HVM production flows with low DPPM

Job Details


Minimum qualifications:

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
  • 8 years of experience with industry-standard tools, languages and methodologies relevant to the production Silicon SoC’s or ASIC’s, including product engineering or test engineering.
  • 3 years of experience in people management, developing employees.

Preferred qualifications:

  • Master’s in Electrical Engineering, Computer Engineering, Computer Science, or related field or equivalent practical experience.
  • 12 years of experience in silicon product engineering or test engineering.
  • Ability to develop and drive relationships with wafer foundry or Offshore Assembly and Test (OSAT) companies.
  • Ability in delivering HVM production flows for high-performance computing chips in advanced technology nodes with low DPPM.

About the job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

The team designs and builds the hardware, software, and networking technologies that power all of Google's services.


In this role, you will design and build the system within our computing infrastructure. You will develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing and mission-mode operation. You will work to shape the machinery that goes into our data centers affecting Google users.

The ML, Systems, & Cloud AI (MSCA) organization at Google designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all Google services (Search, YouTube, etc.) and Google Cloud. Our end users are Googlers, Cloud customers and the billions of people who use Google services around the world.

We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Google Cloud’s Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.

Responsibilities

  • Develop and drive engineering relationships with all High Voltage Module (HVM) suppliers to manufacture SoC and ASIC products, including foundries, Outsourced Assembly and Test (OSAT) providers, assisted-COT, and equipment vendors. Own and drive checkpoints to meet agreed quality and delivery metrics.
  • Manage the team for first-line support for all Engineering issue during HVM, including: die, bumping, substrate, assembly; ATE, handler, socket, LoadBoard, TCU, SLT, burn in, probe card, wafersort, FT, QA, SLT, burn In test program release, datalogs, database, yield monitoring, reporting, production excursion control and quality topics, RMA processing and FA with local vendors.
  • Meet or exceed agreed yield, cost, quality Defective Parts Per Million (DPPM) and stability requirements in the HVM supply chain.
  • Partner with Silicon Operations team to support delivery of finished goods meeting agreed schedules and volumes.

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