Wafer Fabrication Manufacturing Engineer Staff

9 Hours ago • 10 Years + • Manufacturing • $174,000 PA - $258,000 PA

Job Summary

Job Description

This role involves leading and scaling up high-volume wafer fabrication manufacturing capabilities. Responsibilities include coordinating with various teams to meet manufacturing readiness requirements, optimizing wafer fabrication processes for yield and manufacturability, and fostering a data-driven engineering culture. This will involve utilizing Statistical Process Control (SPC), Design of Experiment (DOE), Lean Manufacturing, and problem-solving methodologies. The ideal candidate will have extensive experience in semiconductor wafer fabrication and process engineering, with a strong background in quality control and Six Sigma.
Must have:
  • 10+ years in semiconductor wafer fabrication process engineering
  • Leadership experience in volume production environment
  • Quality control/management experience
  • Green Belt Six Sigma
  • Process optimization and improvement
  • Data-driven decision making
Good to have:
  • Master's/PhD in relevant field
  • Engineering management experience
  • New product introduction experience
  • Optoelectronic device fabrication expertise
Perks:
  • Bonus
  • Equity
  • Benefits

Job Details

Minimum qualifications:

  • Master's degree in Electrical Engineering, Optics, Physics, Material, a related field, or equivalent practical experience.
  • 10 years of experience in process engineering and leadership in a volume production semiconductor wafer fabrication environment.
  • Experience in a quality control or quality management role.
  • Experience in Green Belt Six Sigma.

Preferred qualifications:

  • Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/Digital Signal Processing).
  • 4 years of experience in engineering management or 6 years of experience in semiconductor technology.
  • Experience with new product introduction life cycle from concept, ramp through to mass production.
  • Expertise in Optoelectronic Device Fabrication.
  • Ability to work flexibly to support wafer fabrication operations.

About the job

In this role, you will contribute to the innovation behind products loved by millions worldwide and work as part of an exceptional team as we develop a truly novel display technology.

Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.

The US base salary range for this full-time position is $174,000-$258,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about .

Responsibilities

  • Lead and drive the high volume Wafer fabrication Manufacturing capability and scale-up for manufacturing.
  • Coordinate and work closely with Device, Integration, Operation and Equipment team to deliver the fabrication capability and capacity roadmap to meet the manufacturing readiness requirement.
  • Review, propose, optimize, improve and implement various wafer fabrication processes for yield improvement, defectivity reduction, and improved manufacturability.
  • Create a data driven engineering culture through Continous Improvement Process (CIP) which makes full use of Statistical Process Control (SPC), Design of Experiment (DOE), Lean Manufacturing Principle, Structured Problem-Solving, Failure Mode and Effect Analysis (FMEA) and Design for Manufacturing (DFM).

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