Job Details:

Job Description: 

Are you looking for a new challenge that will improve Intel's manufacturing processes? Are you interested in working with development groups on new processes for future products? Join the FSO Yield Department as an Integration Engineer to work on these types of projects. FSO, the Far back end and Sort Organization, is a global organization that supports High-Volume Manufacturing (HVM) as well as Technology Development and Pathfinding activities related to Advanced Packaging. Nearly all of Intel's latest technology wafers are processed through the FSO-Oregon far back-end factory, including some external foundry customer wafers. In the Integration Engineer role, you will be part of the FSO Oregon Integration team, supporting both FBE technology development and high-volume manufacturing.

You will be expected to interact with multiple organizations and groups including VF peer facilitates, LTD, ATTD, and ATM. New product volumes have increased significantly in this segment and so has the complexity of the flows across multiple packaging type. Successfully ramping these new complex flows is critical to Intel's future success.

FSO OR Integration Engineers are responsible for the following duties:

• Ownership of the process heath and product quality of the FBE manufacturing line.
• Work with process modules to design, execute, and analyze experiments to sustain and improve the processes.
• Ownership of critical projects that span high volume manufacturing, process development, and fab-assembly package integration.
• Monitor and respond to end of line yield trends and execute baseline process changes.
• Defect Layer Owner Responsibilities - partner with Defect Metrology tool and system owners to identify and detect yield impactive defects, implement charts, limits, and lot/tool responses for OOCs.
• Must support Focus teams and Task forces by running experiments, analyzing data, and managing experiment logistics.
• Independently own projects and presentations to management.
• Collaborate with senior engineers in the group to play a key role executing process change implementations.
• Effectively work in a highly networked, cross organization role.
• Must be able to extract, analyze, summarize, and present data with recommendations.
• 24x7 on-call response (as part of an engineering rotation) to respond to urgent line issues, excursions, or to support task force-level projects.

The ideal candidate should exhibit the following behavioral traits:

• Learn new processes and flows.
• Make technical decisions and provide technical direction.
• Demonstrate strong listening, written, and verbal communication skills.
• Demonstrate effective communication up and down the organization, including skills to communicate technical issues and status to factory and program leadership.
• Evidence of organizational and planning skills for engineering projects.
• Team building skills.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

• Bachelor’s degree in Physics, Chemistry, Materials Science, Electrical Engineering or related field and 4+ years of experience in a semiconductor manufacturing processing.
• OR Master’s Degree in Physics, Chemistry, Materials Science, Electrical Engineering or related field and 3+ years of experience in a semiconductor manufacturing processing.
• OR PHD in Physics, Chemistry, Materials Science, Electrical Engineering or related field and 1+ year of experience in a semiconductor manufacturing processing.

This position is not eligible for Intel immigration sponsorship.

Preferred Qualifications:

• Experience in a technical leadership role
• Experience with Integration, Defect Metrology, and / or Layer Owner Experience

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US:

$130,300.00-$183,950.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.