SOC Floorplanning Lead

1 Year ago • 12 Years +

Job Summary

Job Description

The SOC Floorplanning Lead will be responsible for establishing integration plans for dies, optimizing for package and board constraints. They will create physical databases, collaborate with architects, derive specifications, and coordinate with the power delivery team. The role also involves bump planning, die file generation, and completing relevant checks before tape-out. The candidate will need to possess expertise in die estimation, package and board level requirements, and a strong understanding of clocking, high-speed design, and industry standard protocols. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization.
Must have:
  • Lead multiple SOCs as SOC Floorplan lead.
  • Strong expertise in design planning and die estimation.
  • Good understanding of package and board level requirements.
  • Knowledge of clocking and high speed design.

Job Details

Job Details:

Job Description: 

Foundry Services (FS) is an independent foundry business that is established to meet our customers' unique product needs. With the first Open System Foundry model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient, and sustainable source of supply.

This job opportunity in FS will be part of the Customer Solutions Engineering (CSE) group which is responsible for the portions of the system foundry that brings the best of Intel technologies to FS customers, differentiating and accelerating their solutions from architecture to post-silicon validation.

We are looking experienced Floorplan Engineer to work on Foor plan, die estimation, Power planning of high performance designs . Responsibilities include

  • Establishes the integration plans for die with optimization for package and board constraints.
  • Bump planning, Die file generation , closing loop with package team on signal and power bump placement restrictions
  • Create physical database for the IP or SoC. Collaborate with architects to optimize the placement of IPs for latency as well as die area/aspect-ratio.
  • Collaborate with the design teams on clocking and dataflow to deliver the physical block level floorplans for APR.
  • Derive specifications and collaterals for the IP blocks to execute the floorplan and automatic place and route (APR) at subsequent hierarchies.
  • Coordinate with power delivery team on trade-offs for metal allocation for signal and power.
  • Have excellent understanding on, die-per-reticle/good-die-per-wafer maximization, and right technology selection on metal layers usage maximization
  • Good knowledge on RDL routing and efficient usage higher metal layers
  • Performs integration of all dies in a package and completes the relevant checks before tape-out.

Qualifications:

Qualification :

  • 12+ Years of relevant Experience After a Bachelor or Master of Engineering degree in Electrical/ Electronic/VLSI Engineering or related field.
  • Must have led multiple SOCs in capacity of SOC Floorplan lead. Strong Expertise in Design planning, die estimation, Good understanding on package and board level requirement .
  • Must have knowledge on clocking , high speed design signal routing, industry standard protocols and IP architecture;
  • Good understanding on relevant areas of Library / Memory / technology/submicron issues .
  • Teamwork / flexibility / ability to thrive in a dynamic environment are very important

          

Job Type:

Experienced Hire

Shift:

Shift 1 (India)

Primary Location: 

India, Bangalore

Additional Locations:

Business group:

Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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