DMTM is looking for candidates who will grow into process integration PI engineering roles reporting to Integration Managers. As a PI engineer you will be responsible for leading teams of technical contributors in enablement of next generation nonvolatile memory integration schemes to support 3DNAND density and performance scaling. Candidates should have relevant previous experience demonstrating sustained creativity in problem solving and technology innovation and able to work across organizations to influence technology development. Successful applicants are expected to perform feasibility studies and provide integrated process solutions to meet desired safety quality reliability and output requirements for ultimate transfer to high volume manufacturing.
The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix
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