Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.
Creates next generation device and interconnect technology by ensuring the process device performance for developing processes is world class, using deep understanding of device physics. Evaluates device performance data, using statistics, data mining, and other data analysis techniques to collect, explore and extract insights from electrical test and process yield data. Develops scripts, algorithms and applications to translate experimental data into intelligence in order to define future development direction. Defines robust test structures and test programs to validate advanced design rules and reliably extract key device and interconnect parameters. Sets device and interconnect performance targets for process design kit releases and interface with design and foundry partners to address circuit level issues. Assesses silicon to simulation health and readiness for high volume manufacturing.
This position is associated with the sale of Intel's NAND memory and storage business to SK. This transaction will enhance the resources and potential of the business' storage, and you will be joining a world-class team that will transition to lead the SSD business at SK group. We will keep you informed updates and steps related to this transaction.
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