HW Product and Mechanical Engineer

2 Months ago • All levels • Manufacturing

About the job

Job Description

NXP is seeking a HW Product and Mechanical Engineer to create cost-effective mechanical solutions for new products and existing production solutions. Must have expertise in 3D CAD, BOM structure, and experience with PCBs, sockets, and test equipment. Experience with thermal simulation, GD&T, and 3D printing is desired.
Must have:
  • 3D CAD (Solidworks)
  • BOM structure
  • PCBs, Sockets
  • Test Equipment
Good to have:
  • Thermal Simulation
  • GD&T understanding
  • 3D printing
  • Solidworks Simulation
Perks:
  • Leadership skills
  • Cross-functional team
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As a HW Product and Mechanical Engineer creates high quality and cost effective mechanical HW solutions including PCBs, sockets, handler kits, interface boards, docking solutions and similar for new products and enablement solutions for improved quality and yield performance of existing production solutions.

Responsibilities:

Mechanical

Develop solutions suggested by team members and add proposed new solutions. 3D CAD (Solidworks) and provide all the necessary drawings, critical to function dimensions and 3D files to allow the design to be prototyped and manufactured. Provide 3D models to be used in thermal simulations. Participate in cross-functional team meetings to resolve production quality issues.

Product

Possess a detailed knowledge of an Aras & ERP system

Comprehensive knowledge of BOM structure and change control processes.

Provide technical support via direct communication to internal customers & contract manufacturer.

Provide technical support and assist in resolution of manufacturing problems as required.

Demonstrate strong attention to detail

Interacts with Contract Manufacturers (CM) to resolve component procurement issues, and review the production cost.

Experience relevant for the internship, to acquire or to have in advance: PCBs, sockets, Test Equipment and various IC package solutions. Static and Thermal Simulation. GD&T understanding and tight tolerance control, and 3D printing.

Tooling:  Solidworks, Solidworks Simulation and Circuitworks, Cadence/Allegro, Simulation/Modeling, Flotherm, Six Sigma Methods, Familiar with CAD software, such as AutoCAD, SolidWorks, Allegro Cadence, CADCAM350 & GC-Prevue, Program Management and Supplier Management. 

The NXP Intern will gain skills in leadership, cross functional team dynamics, data analytics, and presentation. Working with internal customers and vendors. 


More information about NXP in Mexico...

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About The Company

Kaohsiung City, Taiwan (On-Site)

Bengaluru, Karnataka, India (On-Site)

Brno, South Moravian Region, Czechia (On-Site)

Eindhoven, North Brabant, Netherlands (On-Site)

Bucharest, Bucharest, Romania (On-Site)

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