Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.
FDC (fault detection and classification) mission is to minimize product deviation and reduce process variation through early detection of tool health issues. FDC Engineer gain exposure and knowledge of many semiconductor process areas in the fab as they assist them with their process control needs. As node sizes continue to shrink and new technology types are introduced, the work they do directly affects the bottom line of the entire company by providing scrap/excursion control, fault detection and classification (FDC), and overall enhanced process capability. They meet regularly and team with process areas to understand their tools, processes, and challenges and work with them to create process control models, strategies, and other methods for ensuring quality output.
This position is associated with the sale of Intel's NAND memory and storage business to SK. This transaction will enhance the resources and potential of the business' storage, and you will be joining a world-class team that will transition to lead the SSD business at SK group. We will keep you informed updates and steps related to this transaction.
Demonstrated DMTM culture, customer first, results driven, fearless innovation, agility, partnership, integrity, quality and inclusion.Experience with Statistic Process Control, process control charts and statistical methods such as control limit definition, alarm rule setup, and process capability monitoringDemonstrate effectiveness in verbal and written communication, English especially.Strong knowledge of Design of Experiment, data analysis, and analysis of variance (ANOVA)Strong knowledge of semiconductor fab process, tools (including metrology tools) and operation.Demonstrated analytical problem-solving skills and experience with analytical problem-solving methodologies.Demonstrated self-motivation and good work ethic.Proven ability to understand technical subjects and instruct/present effectively.Strong understanding of fab data flow and tool/host communication standards, such as SECS/GEM and EDA.FDC or EP (excursion prevention) experience is a plus.
Master's degree in Mathematics, Software Engineering, Control Science and Engineering, Computer Science and Technology or a related field.
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