Senior Signal and Power Integrity Engineer - Hardware

We are now looking for a Senior Signal & Power Integrity Engineer!

NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can tackle, and that matter to the world. This is our life’s work, to amplify human imagination and intelligence. This is a dynamic team working with state of the art, unique technology. If you are someone that loves a challenge, come join this diverse team and help move the needle!

What you'll be doing:

• Work on crafting creative Signal Integrity solutions to complex system design problems.

• Modeling and Optimization of vias, connectors, sockets, breakouts and various system components in 3D EM tools.

• System-level signal integrity simulations of high-speed NVlink 200Gbs+, USB-4, PCIe5, GDDR6, LP5X and other interfaces.

• Constant improvements of SI models using data from lab measurements and/or modelling tool/methodology updates.

• Substrate and board layout SI guidelines creation, review and post layout SI extractions.

• Simulation automation, data gathering, analysis and visualization using JMP, MATLAB or similar tools.

• Opportunity to work in a dynamic cross-functional role to optimize package, PCB, ASIC, mixed signal circuit.

What we need to see:

• BS/MS-Electrical Engineering or equivalent experience with 6+ years of industry experience.

• Strong technical background in applied electromagnatics, transmission line theory and signal processing will be highly valued.

• SI work on one or more signaling standards like PCI express, USB, SATA, HDMI, HBM, DDR5, GDDR6, LPDDR5X, etc.

• Hands on use of 3-D modeling tools like ANSYS HFSS/Q3D, 2.5-D with ANSYS SIWAVE or similar and 2D such as Ansys2D.

• Familiarity with a system level timing or loss budget including silicon, package and board impairments.

• Familiarity with use of VNA, TDR, DSO, ParBERT and use of tools/applications like ADS, Ansys Designer, JMP, Matlab, Cadence Allegro will be a plus.

Ways to stand out from the crowd:

• Experience in interconnect electromagnetic model design for 200Gbps systems, particularly in backplane and midplane architectures. Hands-on expertise in characterizing and correlating high-speed connectors and cable assemblies in the lab (including using VNA).

• Strong understanding of stamping, plating, and molding processes to effectively collaborate with mechanical and industrial engineers on design trade-offs. Knowledge of characterizing new LCP materials to develop accurate electrical component libraries.

• Ability to conduct statistical analysis of connectors, cables, and cable assemblies to assess performance at production sites, enhancing data-driven decision-making.

• Proficiency in analyzing connector product specifications including mechanical,  environmental, electrical and SI testing requirements.

• Knowledge of circuit design, board/pkg technology & design, link architecture, timing budget methodologies.