Global OSAT Package Principal Engineer
Job Summary
Job Description
The Global OSAT Package Principal Engineer will work with the NXP Global team to drive subcon site transfer and second source qualification. Responsibilities include driving qualification for bumping and assembly quality improvement, VE and subcon’s PCN projects, owning gap analysis, CZ/qual plan, safe launch plan, and overall qualification timeline for site transfer, quality improvement, VE and subcon’s PCN projects. They will also be involved in NPI/NTI to ensure no quality excursion during ramp at subcon, lead technical investigations for quality/yield excursions, review subcon CQC / 8D & proposed actions to prevent recurrence, and provide technical inputs for CIP in subcon assembly. Additionally, the engineer will update Bond Diagrams, Package Kits, Bumping/Assembly Shop Order Flow, and act as a Change Action Board (CAB) member to review and approve NPI/NTI and all changes in subcon.
Must have:
- Degree or MSc in relevant engineering field or equivalent.
- 10+ years of experience in wafer bumping and WLCSP.
- Knowledgeable in DOE, Process Control System, and technical problem solving.
- Strong leadership, project management, and critical thinking skills.
- Effective communication skills in Mandarin and English.
- Understanding of semiconductor product and bumping/assembly/test process.
- Excellent leadership and motivational skills.
Good to have:
- Good knowledge in advanced packages (Panel Level Packaging, 2.5D/3D packaging), Flip-Chip and wire bond packages assembly
3 skills required
Job Details
Requirements:
- Degree or MSc Degree in Mechanical, Material, Manufacturing or Electronic engineering or Equivalent
- At least 10 years working experience in wafer bumping and WLCSP. Added advantages if having good knowledge in advanced packages (Panel Level Packaging, 2.5D/3D packaging), Flip-Chip and wire bond packages assembly.
- Knowledgeable in DOE, Process Control System and technical problem solving methodology
- Possess strong leadership, project management and critical thinking skills
- Can communicate effectively in Mandarin and English; both in verbal and written
- Have a strong semiconductor product and bumping/assembly/test process methodology understanding & trouble shooting skill.
- Excellent leadership and motivational skills. Possess strong interpersonal skills and have the ability to communicate and present across all levels of organization.
- Proven ability and flexibility to lead successfully in a complex, cross-functional multinational environment
- Ability to work independently, be hands-on and expected to dive into technical details
- Self-sufficient and resourcefulness in acquiring the appropriate technical skills and knowledge from resources across the globe
Responsibilities/Job Descriptions:
- Work with NXP Global team to drive subcon site transfer / 2nd source qual.
- Drive qualification for bumping and assembly quality improvement, VE and subcon’s PCN projects (Including BOM/Process Change; Building Move; Production Floor Re-layout, Material Supplier Mfg Site Move; New Equip Model, etc).
- Own gap analysis, CZ/qual plan, safe launch plan and overall qualification timeline for site transfer, quality improvement, VE and subcon’s PCN projects.
- NPI/NTI early involvement to ensure no quality excursion during ramp at subcon.
- Technical lead the quality (CQC/CSET/Severe Incident) improvement with quality team
- Technical lead onsite root cause investigation, analysis and resolution for quality/yield excursion in subcon
- Review subcon CQC / 8D & proposed actions to prevent recurrence
- Review & provide technical inputs for CIP (Continuous Improvement Plan) in subcon assembly
- Update Bond Diagram, Package Kits, Bumping/Assembly Shop Oder Flow and working with Product Engineer on PC parts linkage
- Act as a Change Action Board (CAB) member to review and approve NPI/NTI and all changes in subcon
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About The Company
NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.comRead MoreCareer Development OpportunitiesBright Minds. Bright Futures.We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.Read MoreCommitment At NXP.We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future.
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