Advanced IC Packaging Application Engineer - Foundry

1 Month ago • 8 Years + • $196,830 PA - $277,880 PA

Job Summary

Job Description

The Advanced IC Packaging Application Engineer will work closely with Intel Foundry customers on advanced packaging technologies to define, develop, and implement design tools, flows, and methodologies for system co-design, design implementation, and verification. The role involves being a technical expert on design tools and consulting on design and implementation issues. The ideal candidate should be self-driven, results-oriented, and able to multitask in a fast-paced worldwide environment. They should also possess analytical problem-solving skills and effective communication skills for collaborating with stakeholders and customers.
Must have:
  • US Citizenship required.
  • Ability to obtain a US Government Security Clearance.
  • Bachelor's degree in related field of study.
  • 8+ years of design experience in Package, or IC digital design OR 8+ years of EDA Tool experience.
  • Experience in design for verification and design for performance: (Signal Integrity, Power Integrity, manufacturing, and/or yield.)
  • Experience interfacing with customers and/or stakeholders from remote sites worldwide and analyzing customer design issues, environments, and define functional specs for EDA vendors.
  • Experience with scripting in tcl, Python, SKILL, VBScript, or Perl to automate design flows.
Good to have:
  • Post Graduate degree in Electrical / Computer Engineering, Electronics Engineering, Computer Science, or in a STEM related field of study.
  • Active US Government Security Clearance with a minimum of a Secret level.
  • Experience with Silicon or assembly process, test and characterization techniques.
Perks:
  • Competitive pay
  • Stock
  • Bonuses
  • Health benefits
  • Retirement benefits
  • Vacation

Job Details

Job Details:

Job Description: 

The world is transforming, and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we are establishing Intel Foundry, a fully vertical, stand-alone foundry business, reporting directly to the CEO. Intel Foundry will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally. Foundry Services is already engaged with customers today starting with our existing foundry offerings. We are expanding at a torrid pace to include our most advanced technologies, which are ideal for high-performance applications, and they are completely dedicated to the success of its customers with full profit and loss responsibilities. Using this model will ensure that our foundry customers' products receive our utmost focus in terms of service, technology enablement, and capacity commitments. Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IP's.

Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. The Advanced IC Packaging Application Engineer will work closely with Intel Foundry customers on advanced packaging technologies to define, develop, and implement design tools, flows, and methodologies for system co-design, design implementation, and verification. Will serve as the technical expert on design tools as well as consult on design and implementation issues.

The ideal candidate should exhibit the following behavioral traits:

  • Self-driven and results-oriented and able to multi-task and work in a fast-paced worldwide environment.
  • Analytical problem-solving skills.
  • Effective communication skills and experience in collaborating with stakeholders and customers.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. The minimum requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and / or schoolwork/classes/research. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications 

  • US Citizenship required.
  • Ability to obtain a US Government Security Clearance.
  • Bachelor's degree in Electrical / Computer Engineering, Electronics Engineering, Computer Science, or in a STEM related field of study.
  • 8+ years of design experience in Package, or IC digital design OR 8+ years of EDA Tool experience.
  • Must have the EDA implementation or verification tools from either; Cadence, Synopsys or Siemens i.e.:
  • Multi-die/3DIC platform tools such as: Cadence Integrity, Synopsys 3DIC Compiler, Siemens Xpedition Substrate Integrator/Innovator 3D.
  • Implementation tools such as: Cadence Virtuoso/Innovus, Allegro (Advanced Package Designer, APD/SiP), Siemens Mentor Xpedition (PCB Layout/XPD), Synopsys Fusion Compiler.
  • Verification tools such as: Siemens Calibre, Synopsys ICV, or Cadence Pegasus.
  • Experience in design for verification and design for performance: (Signal Integrity, Power Integrity, manufacturing, and/or yield.)
  • Experience interfacing with customers and/or stakeholders from remote sites worldwide and analyzing customer design issues, environments, and define functional specs for EDA vendors.
  • Experience with scripting in tcl, Python, SKILL, VBScript, or Perl to automate design flows.

Preferred Qualifications:

  • Post Graduate degree in Electrical / Computer Engineering, Electronics Engineering, Computer Science, or in a STEM related field of study.
  • Active US Government Security Clearance with a minimum of a Secret level.
  • Experience with Silicon or assembly process, test and characterization techniques.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US:

$196,830.00-$277,880.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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