Package Quality/Reliability Engineer

The individual in this role is responsible for the planning and execution of the package qualification for new products or test vehicles. The qualification plans should cover, but not limited to, the quality and reliability of a packaging technology, its assembly flow, the bill of materials involved, and the associated testing/analysis methodologies.

Responsibilities

• As a Package Quality/Reliability Engineer, you will be responsible for or focusing on the following working areas:
• Define and execute the qualification and testing/analysis plans for new products, mechanical test vehicles, advanced packaging technologies, changes of assembly flow or site, changes of bill of materials (BOM), and suppliers qualifications
• Identify the quality and reliability risks for the new products development associated with advanced packaging technologies, assembly flow, BOM, etc. Develop experimental designs and approaches to identify key ingredients that lead to a successful product.
• Document the qualification results and the final official qualification reports
• Actively work with silicon/package designers and system platform teams in new products or test vehicles activities
• Work closely with program managers in resource and schedule planning
• Work closely with 3rd-party partners to conduct the reliability execution plans as required.
• Drive any improvement plans, if identified, in the quality and reliability of the products and technologies.

Requirements

• Experienced in the package qualification procedures and reliability specifications (preferred in HPC-related applications), including component-level and board-level reliabilities.
• Knowledge of reliability experiments planning, testing techniques, and associated data analysis is highly desirable.
• Familiar with related JEDEC and/or IPC standards
• Knowledge of thermo-mechanical stress mechanism, Chip-Package interaction (CPI), potential failure modes for large package sizes, and package/product reliability failure analysis (FA) approaches is highly desirable.
• Experienced in or familiar with 2.5D and 3D advanced packaging technologies.
• Understanding of the package assembly and package-on-board process flows is a plus.

Education and Experience

• Ph.D. or Master degree in Electrical Engineering, Material Science, Solid State Physics, Chemistry, or related technical disciplines.
• Minimum of 7 years of working experience in the subject area