This Design Engineer I role at Cadence requires a candidate with strong knowledge of SCAN/ATPG/JTAG/MBIST and experience with chip tape out, including ATE bring up. The role involves gate-level simulations, experience with test structures for DFT, IP integration, and scan insertion techniques. The candidate will be responsible for Memory BIST generation and JTAG knowledge. The role also involves running block level and chip STA flows, resolving DFT issues, and using industry-standard tools like Cadence/Tessent. Strong teamwork, communication skills, and a sense of responsibility are essential for successful tape out and post-silicon bring up.