Cadence Design Systems is looking for a candidate to be part of its Product Engineering Team in the System Design and Analysis group, with focus on Advanced IC Package Routing, Technologies, and Flows.
As an IC Packaging Product Engineer, you will be responsible for driving innovation and expanding Cadence IC Packaging Advanced Routing and Automated Solutions leadership, tackling the complex substrate interconnect challenges of advanced package designs. The Product Engineer bridges the gap between customers and R&D, ensuring existing tools meet customer needs while innovating new industry-leading solutions. You will be responsible for creating detailed specifications, collaborating with R&D for implementation, creating product documentations, and delivering customer presentations. The Product Engineer must work with different teams and customers to collaborate, understand needs, create guidance for implementation, and support successful customer adoption/proliferation. The role requires direct collaboration with Research and Development, Product Marketing, Technical Field Operations, and key customers.
We are looking for an individual with a passion for innovation, self-driven, detail-oriented, and a strong background in IC Packaging.
The Position Requirements are:
The annual salary range for California is $136,500 to $253,500. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.
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